1. CEE News Magazine Archive

Low-profile connectors meet tight space requirements

Nov. 1, 2000
The low-profile, angled DIMM (Dual Inline Memory Module) connector enables stacking heights of 0.9 in. for typical SOJ packaging and 0.525 in. for TSOP packaging. This durable connector features dual ejector latches that align modules for insertion and produce an audible click when closed. Forklocks provide good PCB retention during and after soldering. The .050 in. pitch DIMM connector has a 3.3V

The low-profile, angled DIMM (Dual Inline Memory Module) connector enables stacking heights of 0.9 in. for typical SOJ packaging and 0.525 in. for TSOP packaging. This durable connector features dual ejector latches that align modules for insertion and produce an audible click when closed. Forklocks provide good PCB retention during and after soldering. The .050 in. pitch DIMM connector has a 3.3V center voltage key and three function key options in a range of select-gold plating thicknesses. Molex Inc.

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